【英特尔发布未来芯片封装蓝图 将采用玻璃基板设计】美港电讯APP 5月19日讯，据英特尔官网消息，英特尔(INTC.O)发布了先进封装技术蓝图。在蓝图中，英特尔期望将传统基板转为更为先进的玻璃材质基板。英特尔表示，玻璃基板不仅能提高基板强度，还可以进一步降低功耗，提升能源利用率。#FXTM富拓#
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